-- Definitions --
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ADC -- Analog-to-Digital Converter
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BDM -- Background Debug Mode
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CAN -- Controller Area Network
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CDIP -- Ceramic Dual In-Line Package
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CLCC -- Ceramic Leaded Chip Carrier
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CMB -- Microcontroller Memory Board
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COP -- Computer Operating Properly (Watchdog Timer)
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CPU16 -- 16-Bit Central Processor Unit (HC11 Compatible)
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CPU32 -- 32-Bit Central Processor Unit (68000 Compatible)
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CTM -- Configurable Timer Module (Various Hardware Options)
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DIP -- Dual In-line Package
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DTMF -- Dual-Tone Multi-Frequency
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EBI -- External Bus Interface
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EM -- Emulation Module
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EVB -- Evaluation Board
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FPGA -- Field Programmable Gate Array
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GPT -- General-Purpose Timer Module (4 IC, 5 OC, 2 PWM)
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IC -- Input Capture
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I2C -- Inter-Integrated Circuit
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ICS -- In-Circuit Simulator (Board)
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IDE -- Integrated Development Environment
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i/o -- Bidirectional Input and Output Port Pins
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i -- Input-Only Port Pins
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IPB -- I/O Peripheral Board
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ISPI -- Interval Serial Peripheral Interface
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KBI -- Keyboard Interrupt
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LCD -- Liquid Crystal Display
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LTD -- Limited Availability
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LQFP -- Low-Profile Quad Flat Pack
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LVI -- Low-Voltage Interrupt
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LVR -- Low-Voltage Reset
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MC -- Fully Qualified Production
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MCCI -- Multi-Channel Communication Interface (2 SCI, SPI)
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MEVB -- Modular Evaluation Board
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MFT -- Multi Function Timer
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MMDS -- Motorola Modular Development System
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MMEVS -- Motorola Modular Evaluation System
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MPB -- Microcontroller Personality Board
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MUX -- Multiplexed
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o -- Output-Only Port Pins
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OC -- Output Compare
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PC -- Pre-Qualification, Engineering Samples Only
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PEEP -- Personality EEPROM
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PEP -- Personality EPROM
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PFB -- Platform Board
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PLCC -- Plastic Leaded Chip Carrier
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PLL -- Phase-Locked Loop
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PPB -- Package Personality Board
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PQFP -- Plastic Quad Flat Pack
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PWM -- Pulse-Width Modulation
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QADC -- Queued Analog-to-Digital Converter (10-Bit)
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QFP -- Quad Flat Pack
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QSM -- Queued Serial Module (SCI + QSPI)
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QSPI -- Queued SPI
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RTI -- Real-Time Interrupt
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SCI -- Serial Communication Interface
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SCI+ -- Enhanced SCI
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SCIM -- Single-Chip Integration Module
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SDI -- Serial Debug Interface Cable (BDM Cable)
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SDIP -- Shrink Dual In-line Package
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SIM -- System Integration Module
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SIML -- Low-Power System Integration Module
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SIOP -- Simple Serial I/O Port
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SPI -- Serial Peripheral Interface
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SPI+ -- Enhanced SPI
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SRAM -- Standby RAM Module
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TC -- Target Cable
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TH -- Target Head Adapter
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TIB -- Target Interface Board
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TPU -- Time Processing Unit (16 Programmable Channels)
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TPURAM -- Standby RAM Module with TPU Emulation Capability
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UART -- Universal Asynchronous Receiver/Transmitter
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USB -- Universal Serial Bus
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XC -- Initial Production Qualification, Not Fully Characterized
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-- Package Designators --
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B -- Shrink DIP (70 mil spacing)
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DW -- Small Outline (Wide-Body SOIC)
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FA -- 7 x 7 mm Quad Flat Pack (QFP)
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FB -- 10 x 10 mm Quad Flat Pack (QFP)
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FE -- CQFP (windowed) -- Samples Only
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FN -- Plastic Quad (PLCC)
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FS -- CLCC (windowed) -- Samples Only
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FT -- 28 x 28 mm Quad Flat Pack (QFP)
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FU -- 14 x 14 mm Quad Flat Pack (QFP)
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FZ -- CQFP (windowed) -- Samples Only
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K -- Cersdip (windowed) -- Samples Only
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L -- Ceramic Sidebraze
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P -- Dual in-Line Plastic
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PU -- 14 x 14 mm Low-Profile Quad Flat Pack (LQFP)
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PV -- 20 x 20 mm Low-Profile Quad Flat Pack (LQFP)
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S -- Cerdip (windowed) -- Samples Only
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