3 General Safety Precautions and Usage Considerations
3.1 From Incoming to Shipping
3.1.1 Electrostatic Discharge (ESD)
3.1.2 Vibration, Impact and Stress
3.2 Storage
3.2.1 General Storage
3.2.2 Moisture-Proof Packing
3.3 Design
3.3.1 Absolute Maximum Ratings
3.3.2 Recommended Operating Conditions
3.3.3 Derating
3.3.4 Unused Pins
3.3.5 Latch-up
3.3.6 Input/Output Protection
3.3.7 Load Capacitance
3.3.8 Thermal Design
3.3.9 Interfacing
3.3.10 Decoupling
3.3.11 External Noise
3.3.12 Electromagnetic Interference
3.3.13 Peripheral Circuits
3.3.14 Safety Standards
3.3.15 Other Precautions
3.4 Inspection, Testing and Evaluation
3.4.1 Grounding
3.4.2 Inspection Sequence
3.5 Mounting
3.5.1 Lead Forming
3.5.2 Socket Mounting
3.5.3 Soldering Temperature Profile
3.5.4 Flux Cleaning and Ultrasonic Cleaning
3.5.5 No Cleaning
3.5.6 Mounting Tape Carrier Packages (TCPs)
3.5.7 Mounting Chips
3.5.8 Circuit Board Coating
3.5.9 Heat Sinks
3.5.10 Tightening Torque
3.6 Protecting Devices in the Field
3.6.1 Temperature
3.6.2 Humidity
3.6.3 Corrosive Gases
3.6.4 Radioactive and Cosmic Rays
3.6.5 Strong Electrical and Magnetic Fields
3.6.6 Interference from Light
(ultraviolet rays, sunlight, fluorescent lamps and incandescent lamps)
3.6.7 Dust and Oil
3.6.8 Fire
3.7 Disposal of Devices and Packing Materials