4 Precautions and Usage Considerations Specific to Each Product Group
4.1 Optical Semiconductor Devices
4.1.1 Precautions Common to All Optical Semiconductor Devices
4.1.2 Visible LEDs
4.1.3 Photosensors
4.1.4 Photocouplers
4.1.5 Fiber-Optic Devices (TOSLINK*)
4.1.6 Visible Semiconductor Lasers
4.2 Power Devices
4.2.1 Vibration and Impact
4.2.2 Design
4.2.3 Inspection, Testing and Evaluation
4.2.4 Mounting
4.3 Microcontrollers
4.3.1 Design
4.4 ASIC Products
4.4.1 Design
4.5 Bipolar ICs
4.5.1 ICs for automotive use
4.5.2 Communication equipment ICs
4.5.3 Audio/Video equipment ICs
4.6 CCD Image Sensors
4.6.1 Storage
4.6.2 Mounting