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Fujitsu provides semiconductor packages as a kind of "interposers" for protecting semiconductor devices and getting the full benefit of them.
Fujitsu has developed and released a diversified series of "general-purpose package families" supporting a wide range of applications to suit customers' needs.
The packages include through-hole type packages such as DIPs, ZIPs, and PGAs; QFPs and SOPs that contributed to setting the trend of surface mounting; and multipin QFPs, TCPs, and SVPs supporting high-tensity mounting.
In addition, Fujitsu has developed and provided custom packages, cards, and modules for specific customers.
The Package Guide contains the Device-Package Cross Reference, Package Contents and Tube and Tray Quantities.
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