SN74ALVC16409
9-BIT, 4-PORT UNIVERSAL BUS EXCHANGER
WITH 3-STATE OUTPUTS

SCAS259 - NOVEMBER 1993 - REVISED MARCH 1994

features

• Member of the Texas Instruments Widebus+^TM Family
• EPIC^TM (Enhanced-Performance Implanted CMOS) Submicron Process
• UBE^TM (Universal Bus Exchanger) Allows Synchronous Data Exchange
• Designed to Facilitate Incident-Wave Switching for Line Impedances of 50-or Greater
• Typical V_OLP (Output Ground Bounce) < 0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) > 2 V at V_CC = 3.3 V, T_A = 25°C
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Bus-Hold On Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

Widebus+, EPIC, and UBE are trademarks of Texas Instruments Incorporated.

description

The SN74ALVC16409 allows synchronous data exchange between four different buses.

Data flow is controlled by the select (SEL0-SEL4) inputs. A data-flow state is stored on the rising edge of the clock (CLK) input, provided the select-enable () input is low. Once a data-flow state has been established, data is stored in the flip-flop on the rising edge of the CLK, provided is high.

The data-flow control logic is designed to allow glitch-free data transmission.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVC16409 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ALVC16409 is characterized for operation from -40°C to 85°C.