SN54LVT245B, SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS

SCES004A - JANUARY 1995 - REVISED NOVEMBER1996

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

features

• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
• High-Impedance State During Power Up and Power Down
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical V_OLP (Output Ground Bounce) < 0.8 V at V_CC = 3.3 V, T_A = 25°C
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Power Off Disables Inputs/Outputs, Permitting Live Insertion
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs

description

These octal bus transceivers are designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices are designed for asynchronous communication between data buses. They transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable () input can be used to disable the devices so the buses are effectively isolated.

When V_CC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT245B is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed circuit board area.

The SN54LVT245B is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT245B is characterized for operation from -40°C to 85°C.