SN74ALVCH16501
18-BIT UNIVERSAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS

SCES024A - JULY 1995 - REVISED NOVEMBER 1996

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

features

• Member of the Texas Instruments Widebus^TM Family
• EPIC^TM (Enhanced-Performance Implanted CMOS) Submicron Process
• UBT^TM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds
  200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

  EPIC, UBT, and Widebus are trademarks of Texas Instruments Incorporated.

description

This 18-bit universal bus transceiver is designed for 2.3-V to 3.6-V V_CC operation.

Data flow in each direction is controlled by output-enable (OEAB and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, should be tied to V_CC through a pullup resistor and OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

Data flow for B to A is similar to that of A to B but uses , LEBA, and CLKBA. The output enables are complementary (OEAB is active high and is active low).

The SN74ALVCH16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed circuit board area.

The SN74ALVCH16501 is characterized for operation from -40°C to 85°C.