SN54LV574, SN74LV574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS

SCLS199B - MARCH 1993 - REVISED APRIL 1996

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

features

• EPIC^TM (Enhanced-Performance Implanted CMOS) 2-u Process
• Typical V_OLP (Output Ground Bounce)
  < 0.8 V at V_CC, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
  > 2 V at V_CC, T_A = 25°C
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), Ceramic Flat (W) Packages, Chip Carriers (FK), and (J) 300-mil DIPs

  EPIC is a trademark of Texas Instruments Incorporated.

   

description

These octal edge-triggered D-type flip-flops are designed for 2.7-V to 5.5-V V_CC operation.

The 'LV574 feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN74LV574 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LV574 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LV574 is characterized for operation from -40°C to 85°C.