TI DSPS 3rd Party Listings: Development Boards: TMS320C50 Interface Rapid Prototype Kit

Digital Signal Processing Solutions Tools: Development Boards

Product Name:	TMS320C50 Interface Rapid Prototype Kit
Company Name:	SIGNALWARE Corporation
Features & Benefits:	DSP and FPGA combine for very fast processing Dynamically configurable FPGA--3k-19k gates 32K 16-bit external 0 wait state SRAM 1024x9x2 bidirectional FIFO RS422 buffered sync. and asynch. serial ports Buffered discrete I/O (4 in, 8 out) Generic parallel I/O port under FPGA control
Platforms Supported:	Standalone
Host Platforms Supported:	RS232 or JTAG
TMS320 Devices Supported:	C5x
CPU:	1
Clock Speeds Available (MHz):	40
Board Size:	7.75" 4.375" 2.375"
Memory (DRAM/SRAM):	SRAM
Expansion Options:
Software Included:	Libraries
Technical Support/Training Available:	YES Tech support by phone or on site, on a per-hour basis. Design services for custom FPGA programs.
Overview:	The prototype kit demonstrates the speed, power and flexibility of a DSP combined with an FPGA. The kit includes a TI C50 DSK, Xilinx 4003/5202 FPGA, UART, FIFO, SRAM, circuit board, and enclosure, combined with socketed ICs and front panel connectors for durability and easy repair, suited for a prototyping environment. TI's DSK consists of a TMS320C50 40 MHz fixed point DSP processor, and an AIC for audio frequency analog I/O. The kit includes demonstration software for the C50, FPGA configuration modules, and a dynamic FPGA loader. These programs are useful as a starting point for custom code. Applications include: C40 parallel port interface, parallel printer interface, feedback control, and an all-purpose interface adapter. The kit can be purchased preassembled.
Company Information:	SIGNALWARE Corporation P. O. Box 50225 Colorado Springs CO 80919-0225 USA Tel: 719-593-0509 Fax: 719-593-1705 e-mail: djnewman@signalware.com www: http://www.signalware.com/dsp
	Hardware design, software and prototypes for DSP and real-time, embedded microprossors. Experienced in ultra-sonics, video, radar, welding, cellular, neural nets and satellites.