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A new line of "Known Good Die" DSP functions now available from Texas Instruments Military Products will enable both military and commercial designers to create customized packaging solutions for space-conscious applications.
The line includes bare-die products from across TI's industry-leading TMS320 DSP family. Selected first- and second-generation family members guaranteed to meet data sheet specifications are available in either commercial (0 to 70 degrees C) or military (-55 to 125 degrees C) temperature versions. In addition, TI is offering selected third-, fourth- and fifth-generation fixed- and floating-point devices that meet the testing requirements described by MIL-STD-883.
"Known Good Die" are bare ICs that have been screened and are known to be capable of functioning across a set of predetermined limits. Whether commercial or military versions, they are expected to operate with the same performance and reliability as their packaged ounterparts. Exotic packaging applications such as standard or custom multichip modules (MCMs) depend heavily upon this type of pre-tested die.
"It is critical that designers use known good die to achieve reasonable module yield," said Weldon Beardain, TI Military Products MCM marketing manager.
"In addition to the known reliability, you get the benefits of minimal rework and simplified electrical tests. Testing ICs once they are embedded inside a module is very costly."
First- and second-generation fixed-point devices available as either commercial or military temperature range known good die include: '320C10, '320E14, '320C15, '320E15, '320C25 and '320C26B. These products are screened on the wafer using a hot chuck probe or equivalent procedure.
The SMJ320C30KGDM33A, SMJ320C31KGDM33A and SMJ320C40KGDM33A floating-point devices use a removable tape automated bonding (RTAB) technique to allow for full device test. With this method, die pads are bumped and then attached to a standard TAB frame with optimized bonding parameters to allow for future removal. After screening is completed, the die are removed from the frame and shipped as bumped die. Manufacturers can then use standard gold wire bonding techniques to make connection to the remaining bumps.
The SMJ320C50KGDM50A utilizes a testing process named DieMate™ to fully screen devices to MIL-STD-883 specifications. DieMate carriers are individual die holders that use a membrane probe technology to make electrical contact for any desired test screening. After testing, the parts are removed and shipped as individual die.
These products are available now from Texas Instruments and authorized distributors . Please contact your field, factory or distributor representative for pricing and delivery information.
May, 1995, vol. 12, no.4