Licensing a digital signal processor (DSP) core sometimes can be a good solution for an OEM. There's no question, though, that licensing the core and getting full DSP solution support as part of the deal is better.
That's why Texas Instruments has developed a unique core licensing approach built around our customizable DSP (cDSP) methodology. We offer customers the opportunity to gain the economic benefits of licensing, but we never abandon them through the product life cycle. We contribute ASIC expertise, industry-leading development tools, software algorithms, and third party and field support to be sure that the final product, not just the DSP core, measures up to expectations.
TI's cDSP methodology offers lower system costs with higher performance,
smaller size and reduced power requirements while also providing
the feature sets needed for specific applications. TI and its
customers work together to select precisely the right DSP core
from the TMS320 family. Then they define the peripherals required
for the application and embed them in TI's gate array or standard
cell libraries to create application specific DSP devices.
Because TI is a leader in both DSP technology and ASIC design and manufacture, we are able to take this comprehensive approach to core DSP licensing. Our customers never have to worry that variations in wafer fab operations or quality control will interfere with the performance of the final product.
In fact, cDSP methodology helps our customers gain a number of advantages as they design application specific integrated circuits around a core DSP.
1. Comprehensive design support. A design house that creates and licenses a DSP core may have limited experience with the ASIC vendor's software tool suite. Conversely, the ASIC vendor may know little about the DSP architecture. When a design snag occurs, the customer is caught between two -- or sometimes more -- vendors who lack the overall experience to help merge the ASIC macros and DSP core into a high-speed integrated design.
TI's cDSP methodology eliminates these potential problems by bringing DSP and ASIC expertise together to provide a complete solution. cDSP design teams and field engineers head off snags before they occur. As a result, our customers achieve first-pass success and get new products to market faster.
2. Error correction and debugging. Few OEMs possess the engineering capabilities needed to test and correct errors in complex, custom integrated circuits. They may have the DSP background or the ASIC skills, but chances are they do not combine both in their own laboratories.
TI bridges this knowledge gap with comprehensive suites of development tools, software algorithms and third-party support. Our engineers understand the complexities of ASIC design and have the advantage of working with proven gate arrays and library modules to create IC devices that fit customers' needs.
3. True application specific design. Because design houses depend on a broad base of customers for their DSP core licenses, they often design to the lowest common denominator. They take a one-size-fits all approach that may sacrifice performance for versatility.
cDSP methodology results in high levels of integration, incorporating
a customer's specific performance and peripheral requirements,
without making any sacrifices. TI offers a wide variety of core
choices and also provides a roadmap for the future. An OEM can
prove a product with discrete components or easily manufactured
ASICs and then move to more sophisticated designs as the market
grows.
4. Manufacturing process control. Each ASIC vendor has its own fabrication processes, and different approaches can result in wide variances in electrical performance, power dissipation, etc. Unless the DSP core is optimized for the vendor's process, serious timing problems and functional flaws may result.
Harmonized processes within TI's worldwide manufacturing facilities ensure that such problems will not arise in cDSP production. TI controls all of the delicate variations that can make a difference in the ultimate performance of our IC devices.
TI's cDSP methodology assures that tools, integration theory, manufacturing processes and customer support work together at every step of the product life cycle. We believe that our customers want more than a licensed DSP design that arrives an orphan at their receiving docks.
Our customers want a complete IC package that will perform on the first pass. We have created hundreds of designs using our cDSP methodology. The best measure of our commitment is that every one has worked the first time.
February 1996, vol. 13, no. 1
TI Home
Search
Semiconductor Home