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July 1996, vol.13, no. 5
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Access TI's on-line technical documentation.
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New TI technology doubles transistor density
Texas Instruments opened a new era in semiconductor integration and versatility with the recent disclosure of its 0.18-micron TImeline technology. Packing as many as 125 million transistors onto a single piece of silicon, TImeline more than doubles the transistor density possible with current 0.25-micron processes. The TImeline platform also provides for the best combination of speed, performance and power consumption in the semiconductor industry. Optimized for applications such as telecommunications, engineering workstations and high-end computers, TImeline devices can perform at 500 MHz or more at 1.8-V. Configured for wireless applications or consumer products, TImeline devices require only 1-V at 200 MHz. For designers, TImeline clears the way for true system-on-a-chip development. The extremely high transistor count permits digital signal processor (DSP), microprocessor or microcontroller cores to be integrated with SRAM, DRAM or FLASH memory, analog or mixed-signal devices and equipment-specific modules on one chip. An industry leader in providing integrated solutions, TI is uniquely positioned to help system designers take full advantage of the increased functionality enabled by the new 0.18-micron TImeline technology. TI's leadership in gate array and standard cell products, combined with the industry's broadest standard product and DSP families, permits increased design freedom. A system designer can choose the best combination of core-based, ASIC and standard product solutions, all from a single vendor. The ultra-high transistor density available with TImeline 0.18 micron technology creates new opportunities to build on existing designs, cutting the product design cycle significantly. As the ability to integrate an entire system on a single chip becomes reality, customers will look for total solutions, said Rich Templeton, president of TI's Semiconductor Group. That includes everything from the silicon itself to design tools, packaging and testing Templeton added, TI's broad line of digital and mixed-signal products, worldwide submicron manufacturing facilities, process technology, service and support put TI in a unique position to fully serve the customer. Introduction of the TImeline technology 0.18 micron process, along with the recent announcement of the $2 billion DMOS6 megafab complex in Dallas, which is targeted for DSP production, show our continuing commitment to leadership in integration and DSP solutions. The addition of 0.18-micron technology to TI's 0.65-micron, 0.5-micron, 0.35- micron and 0.25-micron capabilities gives Texas Instruments the most complete submicron technology portfolio in the industry. Initial design engagements employing the TImeline platform currently are in progress. Production is scheduled to begin in 1997. |
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