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New Audio Power Amplifier from Texas Instruments Provides Complete Stereo Audio SolutionPlug N’ Play Evaluation Platform Allows Designers to Select the Appropriate Audio Power Amplifier
DALLAS (April 21, 1997) -- Expanding its line of audio power amplifiers, Texas Instruments announces a new 1.5W single chip stereo audio solution. The new amplifier provides two 1.5W bridge-tied load (BTL) channels, a 600mW single ended (SE) stereo line output and a stereo input MUX, all in TI’s very low profile 24-pin PowerPAD™ package. This complete stereo audio solution is ideal for applications such as notebook computers, portable multimedia systems and speakerphones. This device, designated the TPA0102, is capable of delivering greater than 1.5W of continuous rms power per channel (BTL) into a 4W load. This is achieved with less than 0.05% THD+N, making it the lowest distortion single-chip audio solution in the industry for low-voltage applications. If single-ended drive is required, the TPA0102 provides 600mW of output power per channel. The switch between BTL and SE mode is achieved by a control signal which allows both single-ended and bridged-output drive from a single device. For notebook applications, this function was previously accomplished with three separate chips -- two mono amplifiers and a third chip for headphone drive. An input MUX circuit is integrated to allow two sets of stereo inputs to the amplifier, which is helpful when both speakers and headphones are being driven, since they may require different signal conditioning to provide the best possible sound to the user. A shutdown pin is also available for power-sensitive applications holding the supply current to below 1µA. Features/Benefits
End equipment applicationsApplications for the TPA0102 include:
Pricing, Packaging and AvailabilityThe TPA0102 is now available from Texas Instruments and its authorized distributors at a suggested price of $2.54 in quantities of 1,000. The TPA0102 is available in TI’s PowerPAD™ package, a 24-pin thin shrink small-outline package (TSSOP). The PowerPAD™ package has an exposed thermal pad on its bottom that can be soldered directly to the printed circuit board (PCB) to provide extra heatsinking. The four corner pins are connected directly to this thermal pad and also assist in this heatsinking process. With this innovative packaging, TI can provide audio solutions in much smaller packages than have previously been available.For testing purposes, a stand-alone evaluation module (EVM) is available from Texas Instruments, which gives the designer an easy decision tool when selecting a TI audio power amplifier for their particular application. This EVM is compatible with TI’s new Plug N’ Play evaluation kit. The kit includes the evaluation platform, two external speakers, speaker wire, audio input cable and a manual for operation. The platform has input and output connections for easy connection of the audio source and external speakers. The price for the EVM is $70, and the price for the kit and the EVM is $199. # # # |