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Texas Instruments Introduces New 6-W Per Channel Stereo Audio Power Amplifier

High Output Power and Low Distortion Available in a 20-pin PowerPADÔ Package

  DALLAS (May 12, 1997) -- Strengthening its position in the audio power amplifier market, Texas Instruments (TI) announces a new 6-W per channel stereo audio power amplifier. The device offers high output power and low distortion, and is ideal for multimedia applications such as sound cards and portable multimedia systems.

This device, designated the TPA1517, contains two identical amplifiers capable of delivering 6-W per channel of continuous average power into a 4-W load at 10% THD+N or 5-W per channel at 1% THD+N. The TPA1517 features a mute/standby function for power sensitive applications and high power supply rejection (65dB) for high fidelity sound in noisy environments such as desktop computers. The TPA1517 is available in TI’s PowerPADÔ 20-pin small-outline integrated circuit (SOIC) package that reduces board space while maintaining exceptional thermal characteristics.

Features/Benefits

  •  High output power
    *6-W output (10% THD+N)
    *5-W output (1% THD+N)

Good output power for multimedia applications.
  • High PSRR (65dB)

Increases fidelity of sound.
  • Mute and standby operation

Increases battery life in portable applications.
  • Wide VCC range (9.5V - 18V)

Offers a wide range of supply voltages for the designer.
  • TDA1517P Compatible

Offers an alternate solution to the current market established device.

End Equipment Applications

Applications for the TPA1517 include:

  • Sound cards
  • Portable multimedia systems

Pricing, Packaging and Availability

The TPA1517 is now available from Texas Instruments and its authorized distributors. The TPA1517 is available in a 20-pin PowerPADÔ priced at $1.32; and a dual in-line package (DIP) priced at $1.11, both in quantities of 1,000.

TI’s PowerPADÔ package has an exposed thermal pad that can be soldered directly to the printed circuit board (PCB) to provide extra heatsinking. With only 1.25 in2 of copper area, the PowerPADÔ package can dissipate 2.5W of power at room temperature with zero airflow. Under the same conditions, the standard SOIC package can only achieve half of this value. For multi-layer board applications with a ground plane, the PowerPADÔ package usually requires no extra board space for heatsinking. With the innovative PowerPADÔ package, TI can provide audio solutions in much smaller packages than have previously been available.

 

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