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Next Generation Digital Imaging Sensors Expected to Usher in New PC-imaging Applications

DALLAS (Sept. 15, 1997) -- A new technology for digital imaging sensors disclosed today by Texas Instruments will provide an alternative to cameras based on CCD (charge coupled device) sensors and current CMOS image sensors by combining the best characteristics of both. The technology will help designers of digital and analog cameras offer improved price/performance. More economical digital cameras will encourage additional imaging applications for users of personal computers (PCs). The new digital imaging sensor technology, which is called Bulk Charge Modulated Device (BCMD), features imaging performance comparable with the CCD sensors which are used today in most digital cameras as well as in machine vision and medical imaging applications. Because BCMD is fabricated using high-volume CMOS processes, it will offer improved price/performance over existing CCD sensors. CCD sensors must be made by using more costly non-standard fabrication processes.

"Going back to the 1970s, TI has a long track record with digital imaging sensors based on CCD technology. We've also been a pioneer in the industry in CMOS process technologies," said Ari Reubin, TI's director of digital image sensor products. "Now, we have integrated both of these competencies in BCMD technology to better serve the market for still and video cameras, many of which will be used in conjunction with today's powerful PCs. The improved price/performance of BCMD-based sensors will revolutionize existing applications."

BCMD sensors will exhibit performance capabilities comparable to CCD sensors, including high sensitivity to light, low electrical noise and low die current. In addition, a BCMD sensor will offer the benefits of CMOS sensors such as low power requirements and support for industry-standard 5V power sources. This replaces the complicated and expensive range of non-standard source power voltages required by CCDs.

Since BCMD is based on the same CMOS fabrication processes that TI uses for other types of integrated circuits, on-chip integration of additional capabilities such as analog-to-digital converters and image compression circuitry will be possible for TIs family of BCMD sensors in the future. Plans call for the development of BCMD sensors that are complementary to related technologies where TI is an established industry leader, such as digital signal processors (DSP), mixed signal products and ASICs (application specific integrated circuits).

For more information about TIs family of image sensor products, please visit our web site at http://www.ti.com/sc/docs/msp/disp.htm.

Availability

TI plans to release samples of the first device in its family of BCMD sensors, the TC286 digital imaging sensor, during the first quarter of 1998.

Pricing is expected to be approximately on a par with currently available CMOS digital imaging sensors.

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