Reduced Media Interface for Ethernet PHYs Enables Lower-Cost, Higher-Density Networking Devices
3Com
"3Com is constantly seeking ways to reduce the cost of ownership of its networking solutions. Reducing the pin count of the chips in a system has tangible effects on reducing costs and increasing reliability. The added benefit of multi-vendor support, coupled with 3Com's high volume manufacturing skills, is expected to result in further cost savings."
Pat Overs
Principal Hardware Design Engineer
3Com Europe Limited
Bay Networks
"Bay Networks endorses this multi-vendor RMII proposal. We are focused on increasing the functionality and reducing the cost of our switching products. Reducing the pin complement required between the PHY/MAC components allows switch vendors to achieve higher levels of integration, increase switch port density, and over time, reduce per-port switching cost. This multi-vendor alliance is a major stepping-stone towards achieving these goals."
Ian Crayford
Director of Architecture and Switching Strategy
Bay Networks
Cisco Systems
"This proposed specification will greatly simplify system level integration and reduce our cost on future products. As future considerations get reviewed and implemented within the current framework, this is the MII interface Cisco would like to see adopted by the Networking industry as a whole."
Bruce Weller
Senior Systems Engineer
Cisco Systems
Note -- 3Com is a registered trademark of 3Com Corporation.
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