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Mixed-Signal and Analog Products Amplifiers and Comparators New Product Highlights
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New Rail-to-Rail Operational Amplifiers from Texas Instruments Offer Superior Output Drive and AC Performance for Low-Voltage ApplicationsDALLAS (July 27, 1998) -- Adding to its series of popular low-voltage single-supply amplifiers, Texas Instruments (TI) today announced a new family of low-power rail-to-rail input/output operational amplifiers. The new op amps offer exceptional output drive, AC performance and low noise. The devices are ideally suited for portable equipment, cellular, telecommunications, data acquisition and signal conditioning applications, and offer simplicity of evaluation and design-in. TLV246x Family Offers Rail-to-Rail Input and Output, Highest Performance TI's new TLV246x family features rail-to-rail I/O operation through extended common mode input range, which exceeds the supply rails by 200 mV, and output drive that will source and sink more than +/-90 mA. These two exceptional performance measures solve the limitations of older rail-to-rail I/O amplifiers. In addition, the 11 nV/ÖHz noise floor and 100-µV input offset voltage are among the industry's lowest. The devices operate over a supply voltage range of 2.7 V to 6 V. Highlights of the TLV246x family's AC performance include 4.4 MHz bandwidth and 1.8-V/µs slew rate. To prolong battery life in portable applications, members of the TLV246x family include a shutdown capability that minimizes supply current to an ultra-low 0.6 µA and places the output in a high impedance state. Free Evaluation Module Streamlines Design Customers can receive, at no charge, TI's innovative new Universal Op Amp Evaluation Module, which accelerates evaluation of single and dual versions of TI's op amps, including those in the TLV246x family. An industry first, the Universal Op Amp Evaluation Module is a printed circuit board (PCB) made specifically for evaluating hundreds of signal-conditioning circuits. The module board is divided into four sections for different surface-mount packages: SOT-23, MSOP, TSSOP and SOIC. The PCB layout includes pads for each package type and connecting traces to through-hole and surface-mount passive component pads. All that is needed to complete the circuit are a small number of passive components. Documentation is included for using the module to evaluate up to eleven basic designs. Pricing and Availability The TLV246x family includes single, dual and quad amplifier members, available with and without shutdown. All are fully specified at 3V and 5V. Package and temperature options include SOT-23, MSOP, TSSOP, SOIC and PDIP. All TLV246x devices are characterized for operation from 0°C to 70°C and -40°C to 125°C. Suggested resale pricing in quantities of 1,000, and production availability from Texas Instruments and its authorized distributors, are as follows:
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