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September 1996, vol.13, no. 6
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Access TI's on-line technical documentation.
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 Two gate arrays - Related Article
TI delivers an ASIC trio
0.18-micron technology offers flexibility, innovationTHREE new families of ASIC products will be the first on the market to implement TImeline Technology, the 125-million-transistors-on-a-chip breakthrough from Texas Instruments. The TGC6000 Series CMOS gate array, the TEC6000 Series CMOS embedded array and TSC6000 Series CMOS standard cell families will deliver a powerful combination of system integration and ultra-low power capabilities. These families will provide designers with unlimited flexibility to design a new generation of innovative and energy-efficient computer, consumer and communications systems. Initial gate array beta design engagements are under way, with first prototype shipments forecast for mid-1997. Initial standard cell design engagements are planned for the last half of 1997.New standard cellDesigners of wireless communications systems, hard disk drives and other applications in which power consumption, cost and size are paramount can benefit from TI's new TSC6000 family of standard cell products. Semiconductors in this family, based on TI's recently announced 0.18 micron (L-effective) TImeline technology, offer mixed-voltage core and periphery options down to 1-V while boosting performance as high as 200 MHz.The TSC6000 standard cell family will achieve a 90 percent reduction in power dissipation versus existing ASIC products through sub-1V core and I/O options, synthesis-optimized low-power macro libraries and power management design methodologies. Application-specific memories will also offer power reduction capabilities which allow portions of the memory to be "turned off" automatically when not being accessed. "No longer will batteries in cellular phones, notebook computers or camcorders require recharging every day, nor will batteries in portable CD players, hand-held games or entertainment systems need replacing so frequently," said Mohan Maheswaran, ASIC worldwide strategic marketing manager. "TI's new generation of standard cell products will enable efficient systems to be designed with the emphasis on extending battery life." Chip-sized packaging options will result in systems that are smaller, less expensive and more highly integrated. And, as the industry's highest density CMOS standard cell family, TSC6000 devices permit levels of integration never before achieved. TI's libraries of ASIC-based DSP and system cores help designers take advantage of TSC6000's advanced features while chopping design cycle time in half. Libraries support integration of FLASH, DRAM and SRAM along with mixed-signal devices, A/D converters and RF.
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