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1394 TImes Archive

June 9, 1998

TI Premier Sponsors Developer's Conference

PHY Layout Application Report

Application Request Form

Texas Instruments and Philips Semiconductors Announce...

GPLynx Simplifies 1394 implementation

TI 1394 Software/Devopment Tools

Applications Archive

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TI Premier Sponsors Developer's Conference

Texas Instruments is pleased to announce that it is a PREMIER SPONSOR of the 2nd Annual 1394 Developer's Conference to be held at the Fairmont Hotel in San Jose.

Last years Developer's Conference was a huge success with well over 700 attendees coming together to see the latest 1394 products and learn about the future of 1394. This years conference is on-track to be even bigger with more presentations and more exhibitors.

Texas Instruments will be presenting the following topics at the Developer's Conference:

Monday, June 29, 1998

Tuesday, June 30:

  • Morning Keynote Harry Davoody, Vice President and Semiconductor Group Manager, Texas Instruments

  • Specifying 1394 Capabilities in PC '98 & '99 Personal Computers : Grant Ley - TI PCI Applications Engineer

  • Case Study TI Camera :Randy Lawson - TI 1394 Applications Engineer

  • Device Bay :Mu Afzal

  • Barriers are Falling for 1394: James Snider

We hope you attend the 2nd Annual 1394 Developer's Conference and stop by the TI booth to see what the 1394 World Leader has to offer.

2nd Annual Developer's Conference

WHEN: Monday, June 29 - Wednesday, July 1, 1998
WHERE: Fairmont Hotel, San Jose, CA 170 South Market Street

PHY Layout Application Report

Our outstanding Applications Team has been at it again. Their latest creation is the PHY Layout Application Report. This document makes recommendations for the layout of the PHY and Link layer devices in an IEEE 1394 environment. The optimal performance of an IEEE 1394 bus can be dependent on good board layout. An IEEE 1394 board that does not adhere to good layout guidelines may be susceptible to noise and interference which could diminish the signal integrity. This document is not meant to be a general tutorial on good PCB layout practice; it is meant to highlight those areas of a 1394 node that may need special attention due to the special requirements of IEEE 1394 nodes.

You can download the PHY Layout Application Report at... http://www.ti.com/sc/docs/psheets/abstract/apps/slla020.htm

You can also browse six other Application Reports at... http://www.ti.com/sc/docs/psheets/app_msp.htm

Application Report Request Form

In order to support our valued customers to our fullest, we have now made it very easy for you to request an application report. You can easily request an application report on a design issue or to further facilitate full understanding of TI 1394 silicon. We welcome your Application Request at... http://www.ti.com/sc/docs/msp/1394/request.htm

Texas Instruments and Philips Semiconductor Announce...

DALLAS (May 11, 1998) -- An interoperability agreement for Texas Instruments' (TI) 400 megabit-per-second (Mbps) IEEE 1394 (FireWire™) physical layer interface (PHY) devices was announced today with Philips Semiconductors. The agreement will allow both companies to provide a variety of interchangeable 1394 PHY silicon solutions. These devices are targeted at high-growth applications such as hard-disk drives, personal computers (PCs), digital camcorders and VCRs, digital set-top boxes and digital televisions. As 1394 becomes prevalent in these markets, the need for compatibility is critical.

You can view the complete press release at... http://www.ti.com/sc/docs/news/1998/98042.htm

GPLynx Simplifies Implementation

The following article appeared in the February 1998 issues of Texas Instruments Mixed Signal & Analog Showcase. You can subscribe to Showcase for free at... http://www.ti.com/sc/docs/msp/showcase/msp261.htm

Product Features

  • Supports IEEE – 1394-1995 standard (100 and 200 Mbps)
  • Compatible with TI’s TSB11LV01/TSB21LV03A PHYs
  • 3.3-V operation, 5-V tolerant
  • 50 MHz clock frequency
  • 50-Quadlet (200 bytes) FIFO
  • Characterized for operation from 0°C to 70°C
The TSB12LV31 general purpose link-layer controller merges consumer electronics and computer peripherals by greatly simplifying the implementation of the 1394 high performance serial bus. The TSB12LV31 provides 1394 connection for peripherals with minimum support circuitry.

The device performs bi-directional asynchronous and isochronous data transfers to and from an IEEE-1394 serial bus physical layer device (PHY). Isochronous bandwidth is guaranteed on-demand to specified applications, assuring a constant flow of data for time-critical applications. In addition, an internal 200-byte FIFO is provided on the TSB12LV31 to facilitate asynchronous and isochronous operations.

The TSB12LV31 programmable 8-/16-bit microcontroller interface offers flexibility in selection of the controller. It also features single channel data mover support for isochronous transmit from an unbuffered 8-bit port. The device is tailored and optimized for use as a peripheral link-layer controller (LLC).

Key Applications:

  • Digital cameras
  • Printers
  • Scanners

The TSB12LV31 is available in a 100-pin PZ package (TQFP).

TI 1394 Software/Devopment Tools

Texas Instruments was not only the first company to release 1394 ICs, it was also the first to offer a full line of 1394 Development Kits. In the near future, you will see even more TI 1394 Development Kits available that further increase your ability to design 1394 products based on TI 1394 silicon. The following 1394 Development Kits and Software are available for purchase and download respectively.

TSBKPCI - A host adapter board based on the PCILynx - TSB12LV21A and TSB21LV03A 200Mbps PHY. The most popular 1394 Development kit available from TI. The board can be inserted in to any PCI bus slot to send or receive 1394 data. The kit comes with Lynxsoft 2.2 Software.

The LynxSoft 2.2 is a complete Windows 95 driver kit that has an API that you can use and example code for using it. A test application is included that will show you how to use the interface.

TSBKPCITST - Has the same features as TSBKPCI but also offers Zoom Video signals on header, test connectors, S-RAM and room for additional circuitry. This kit also runs on the Lynxsoft 2.2 software.

TSBKBACKPL - The industry's only backplane PHY is included in this kit. In this application, the TSB14C01 connects to an FB1650 transceiver, which connects to a BTL (Futurebus+) backplane bus. The controlling processor is TI's TMS320C52, 16-bit fixed point DSP. The DSP handles a one-port RS-232 asynchronous interface.

The software runs a text based menu for executing simple packet transfers for testing purposes. It interfaces to one TSB12C01A link layer controller at a time and allows switching among them. It requires a 38.4 KBaud terminal and a custom 6 wire RS-232 cable. TI provides source code that gives examples of how to use the DMA to read and write to the TSB12C01A link layer chip and execute transfers between the TSB12C01A and the local SRAM.

TSBKPRPHRL - The TSBKPRPHRL Designer's Kit uses TIs TSB12C01A link layer controller, 100Mbps TSB11C01 physical layer device and TMS320C52, 16-bit fixed point DSP to create a platform for peripheral development. It features IEEE 1394, RS-232, ISA(PC/104) and voice band interfaces. The PC/104 expansion interface allows the user to connect to off-the-shelf video and data acquisition boards.

The software runs a text based menu for executing simple packet transfers for testing purposes. It interfaces to the TSB12C01A link layer controller and supports transfers between the 1394 cable interface and the ISA bus, requiring a 38.400 KBaud terminal and a standard nine-wire RS-232 cable. It also supports transfers to/from the A/D, D/A converter. The source code is provided to give examples of how to use the DMA to read and write to the TSB12C01A link layer chip, interface to the ISA bus, and interface to the A/D, D/A converter.

Keep an eye open for future development kits from TI that feature the newest and most exciting Links and Phys yet.

To learn more about TI's line of 1394 Development kits, including ordering instructions, visit... http://www.ti.com/sc/docs/msp/1394/evm.htm

1394 Applications Archive

Q: The TSB21LV03A driver output, along with other internal operating currents, is set by an external resistor. This resistor is connected between the RO and R1 terminals and has a value of 6.3k ohms, +-0.5%. Where can I get such a resistor?

A: In our development kit designs, we have used a KOA #RK73H2AT6341D 6.34k ohm resistor,+-.5% in parallel with a KOA #RK73B2AT105J 1.0M, +-5% to achieve a value within the 6.3k ohms +-0.5% range.

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