Smaller Size. Bigger Boom.
A wide range of audio power amplifiers for your wide range of applications.
Your next-generation applications demand high-quality audio in a smaller package. That's why Texas Instruments developed a family of superior audio power amplifier devices along with EVMs and software to help you design your next system. Plus, for increased flexibility, TI offers the PowePAD package for the highest possible thermal dissipation currently available.
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TI's complete line of audio power amplifiers
The Audio Power Amplifier Plug-n-Play Platform and Modules let you evaluate TI's entire line of APAs. Your prep time is eliminated because all modules plug directly into the platform, with no soldering required.
The Audio Power Analysis Program calculates thermal and power data by simulating real-world audio amplifier operation with music and voice .wav files. Available files include the analysis program, documentation, tutorial sound files, as well as additional sound files.
TI's exclusive PowerPAD package offers the
highest thermal dissipation in a surface-mount configuration available today.
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Download the audio power amplifier issue of Sine-On, TI's mixed signal and analog information service. The issue includes design information on the latest products, application reports, evaluation modules, support tools, and more. At the back of each issue are easy-to-use selection charts and cross-reference information to ease device selection. Also, be sure to register for future updates.
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