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Please refer to Event Code: MEM13

HOUSTON (Dec. 8, 1997) -- Texas Instruments (TI) announced today the industry's first synchronous, non-volatile 4-megabit flash memory device to offer a burst interface configurable to 16- or 32-bit wide (x16 or x32) central processing units (CPUs) or microcontrollers (MCUs).

"TI now offers the industry's first x16/x32 configurable flash device, enabling more powerful applications at competitive cost for performance," said Mario Fazio, worldwide flash memory business manager at TI. "With the introduction of the TMS28F033, TI expands its commitment to supporting the flash memory market and to providing the increased flexibility and speed that next-generation CPU and MCU applications demand."

Enabling High-Performance Applications and Design Freedom

TI's TMS28F033 meets the performance demands of designers requiring high-speed data transfer for their applications, such as networking or high-end automobile engine management. In addition to offering a glueless x16/x32 interface, the '28F033 operates at frequencies up to 40 MHz and with data rates approaching 100 megabytes per second. The device also includes 24 kilobytes of protected memory for secure code.

The '28F033 offers key configurable features, providing customers maximum flexibility and freedom to choose what best suits their systems. These options include:

• Synchronous and asynchronous protocol flexibility
• Burst data read
• Configurable burst capability for high-speed data flow
• Hardware-selectable x16 or x32 data bus width
• 3V or 5V user selectable input/output interface
• Linear or interleaved burst access
• Software configurable latency for data burst access

The '28F033 is sampling now, with volume production scheduled for 1Q98 at $14.40 each in 100 unit quantities. The device is available in an 80-pin quad flat pack (QFP).

TI's Broad Flash Memory Portfolio

Already a major supplier of non-volatile memories and a leading producer of ultraviolet erasable programmable read-only memory (UV EPROMs), TI supports the rapidly growing flash market with an extensive product family. The '28F033 builds on the foundation of TI's current flash portfolio, which features product densities ranging from 512 kilobytes to 8 megabytes.

TI's flash family features both single and dual supply products that are socket compatible with other leading-edge flash products on the market today. In addition, TI flash parts address board space requirements with chip-size packaging (CSP), as well as industry-standard thin small outline package (TSOP), plastic small outline package (PSOP), plastic leaded chip carrier (PLCC) and quad flat pack (QFP).

To find out more about TI's TMS28F033 or other flash devices, please visit http://www.ti.com/sc/docs/memory/intro.htm.