Texas Instruments Announces New Method to Assemble DRAM Chips
Innovation could lead to lower chips prices, faster computers
Dallas (April 20, 1998) -- A Singapore research team from Texas Instruments (TI) has developed a new process that can dramatically reduce the time and cost of assembling higher density memory chips used in all types of computers. This revolutionary new process will first appear in notebook and high-end servers within the next two years and could set the trend in building high-density memory modules in the future.
"The new process will mean significant improvements in notebook, server and desktop computer systems," said Ramesh Gidwani, vice president of worldwide memory marketing for TI. "Named board on chip ball grid array, or BOC-BGA™, the new package provides substantial space savings over conventional packages and much better thermal and electrical performance with 64 megabit and larger DRAM chips. In addition, tooling costs will drop to one-half of traditional chip making processes in the introduction of the new product."
The process makes use of printed circuit board (PCB) substrates in place of the conventional lead frame in thin small outline package (TSOP). The BOC-BGA packages are smaller, more efficient, and help to dissipate more heat than the conventional TSOP packages. The new design not only offers all the advantages of a chip-size package (CSP), but also provides a low cost solution in building stacked memory modules, effectively doubling the memory density per square unit.
"The BOC-BGA process is applicable to both center bond as well as peripheral bond silicon chips," said Gidwani. "Companies will be able to use a similar testing process as traditional chip packages, which will allow companies to avoid significant retooling costs."
This new technology is a major improvement over present BGA processes since it does not require major retooling costs. The BOC-BGA makes this possible through its unique packaging concept that makes use of the PCB substrate for testing, which allows TI to maintain the package size while shrinking the die.
The rigid substrate allows higher density module solutions than currently available with TSOP by providing capability to create the vertical interconnections required to stack memory chips. This will have a major impact on the prototyping and developing of new products.
TI plans to phase the BOC-BGA process into its manufacturing plants over the next eighteen months. For more information about TI's memory products, please visit  http://www.ti.com/sc/docs/memory/intro.htm.
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Trademark:
BOC-BGA is a trademark of Texas Instruments Incorporated.
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