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New TI Mixed-Signal Process Technology Drives Higher Levels of Integration in Wireless Telephone Handsets

Key Features of TI's LinEPIC III Mixed-Signal Process

TI's Integration Strengths Enable Optimized Solutions for Wireless Systems

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Texas Instruments LinEPIC* III™ process technology combines digital and analog circuitry on the same chip to enable higher levels of cost-effective integration in wireless phone handsets. Key features of LinEPIC III include:

• Enables merger of:
  • Analog baseband, including RF codec, audio codec speaker drivers and microphone preamplifiers
  • Battery management, including low dropout regulators, switching regulators, charging switches and logic

• Voltage levels:
  • 2.4- to 3.6-V for analog baseband
  • 7- to 20-V capable for battery management (charger input maximum)

• Components include:
  • 3.3-V Std-Vt and Low-Vt CMOS for low-voltage logic and analog functions
  • 7.0-V Std-Vt CMOS for battery voltages
  • NPN transistors provide stable bandgap reference
  • A variety of polysilicon resistors are available for use in mixed-signal applications
  • 10-V poly-poly capacitors for high-resolution codecs, analog-to-digital converters and filters
  • 20-V drain-extended CMOS provides circuit protection with switching power supplies and chargers
  • TI's logic families

• TI is already designing its latest wireless communications products using LinEPIC™ technology.

Trademarks:
LinEPIC and LinEPIC III are trademarks of Texas Instruments Incorporated.

* EPIC stands for Enhanced Performance Implanted CMOS. LinEPIC is a mixed-signal version of the TI digital CMOS process known as EPIC.