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New 32-bit ARM-based microcontroller

'C240 DSP lets designers eliminate hydraulics

PowerFLEX packaging designed for auto needs

Automotive Solutions from Texas Instruments

Value engineering in today's cars

Silicon integration: panacea or problem?

Flash memory devices

PowerFLEX packaging designed for auto needs

TI's PowerFlexª packaging meets automotive needs with high-heat dissipation in space-constrained applications. The surface mount power packages for power ICs are designed to be low-cost and compatible with most existing assembly equipment. Their low profile, thermally enhanced PowerFLEX design makes them the package of choice for space- and cost-sensitive applications that also require high power dissipation capabilities.

The low-profile PowerFlex family is available in 3-, 5-, 7-, 9-, 14- and 15-pin configurations, each with specific technical capabilities. In addition, TI offers the family in both surface mount and through-hole lead configurations.

Product listing chart

Device

DescriptionPackagePrice (1K)
TPIC2101 1Single-phase Low-side PreFET Driver D, N$1.01
TPIC2603 26-Channel Serial Interface Low-side Driver DW, NE$2.40
TPIC62598-Bit Addressable LatchDW, N$1.52
TPIC6273Octal D-Type LatchDW, N$1.52
TPIC65958-Bit Shift RegisterDW, N$1.52
TPIC6A259 38-Bit Addressable LatchDW, NE$1.93
TPIC6A595 38-Bit Shift RegisterDW, NE$1.93
TPIC6B259 48-Bit Addressable LatchDW, N$0.74
TPIC6B273 4Octal D-Type LatchDW, N$0.74
TPIC6B595 48-Bit Shift RegisterDW, N$0.74
1 = Fault protection
2 = On-board diagnostics
3 = Short-circuit and current limit protection
4 = Current limit capability

PowerFLEX is a trademark of Texas Instruments Incorporated.

(c) Copyright 1997 Texas Instruments Incorporated. All rights reserved.
Trademarks, Important Notice!