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In this Issue New 32-bit ARM-based microcontroller 'C240 DSP lets designers eliminate hydraulics PowerFLEX packaging designed for auto needs Automotive Solutions from Texas Instruments Value engineering in today's cars |
PowerFLEX packaging designed for auto needsTI's PowerFlexª packaging meets automotive needs with high-heat dissipation in space-constrained applications. The surface mount power packages for power ICs are designed to be low-cost and compatible with most existing assembly equipment. Their low profile, thermally enhanced PowerFLEX design makes them the package of choice for space- and cost-sensitive applications that also require high power dissipation capabilities.The low-profile PowerFlex family is available in 3-, 5-, 7-, 9-, 14- and 15-pin configurations, each with specific technical capabilities. In addition, TI offers the family in both surface mount and through-hole lead configurations. Product listing chart
2 = On-board diagnostics 3 = Short-circuit and current limit protection 4 = Current limit capability PowerFLEX is a trademark of Texas Instruments Incorporated. |