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In this Issue
TI's TMS320C6x pushes the envelope in:
performance,
time-to-market,
design support,
architecture
and tools

DSP Solutions:
  Is hardware holding you back?
  1997 'C6x Training

Other Stories:
  Video restoration on a multiple TMS320C40 system
  New DSP Starter Kit for high-performance 'C54 DSPs
  TI SC Group earns worldwide ISO 9001 designation for quality standards

Product Update
  RS-485 differential transceiver
  A/D converters
  FlatLink transmitter/receivers

Trade Shows

Trade Shows

Wireless Symposium

  • February 11-13, 1997
  • Santa Clara Convention Center, Booth 1241
  • Santa Clara, CA
The Wireless Communications Business Unit will show system designers how TI is putting innovation and time on their side with Digital Signal Processing Solutions. The WCBU will demonstrate TI's new generation of TMS320C6x DSPs as well as new technologies such as FLEX™ advanced analog and digital system solutions.


Photonics West

  • February 11-13, 1997
  • San Jose Convention Center, Booth 1812
  • San Jose, CA
Texas Instruments Image Sensor Technology Center will display a full line of area array image sensors and camera products. TI will demonstrate a digital PC camera featuring the TC236, a 680x500 pixel CCD featuring a mosaic color filter and a chipset that allows for digital output via the 1394 Firewire Bus.


Toy Fair

  • February 14-17, 1997
  • Javits Convention Center, Booth 1128
  • New York, NY
The world's leader in speech synthesis, Texas Instruments provides a dimension that will make your products more useful, informative or just plain fun. At Toy Fair '97, TI will demonstrate the MSP50C3X and TSP50C0X/1X family of speech synthesizers, software capabilities and third-party hardware and software support.


Wireless CTIA

  • March 3-5, 1997
  • Moscone Center, Booth 2837
  • San Francisco, CA
The Wireless Communications Business Unit will demonstrate how analog, mixed-signal and digital technology work together to produce Digital Signal Processing Solutions for the development of innovative wireless systems.

Products represented include:

  • TMS320FLEX1 Chipset
  • TCM8030 Baseband Processor for Analog Phones
  • TMS320C6x Family of DSPs
  • Digital Baseband Platform for Wireless Systems
  • Analog Baseband Audio Interfaces and RF CODECs
  • System Power Management

Computer Telephony

  • March 4-6, 1997
  • Los Angeles Convention Center, Booth No. 345
  • Los Angeles, CA
Texas Instruments will demonstrate its line of DSP products and solutions for modem, telephony, networking, data acquisition, computer audio and other applications. As the industry leader in the backbone technology supporting computer and communications applications, TI will highlight its latest generation DSPs.


China International IC Conference & Exhibition

  • March 13th - 14th & March 17th - 18th
  • Beijing Shanghai
Texas Instruments will demonstrate its leadership capabilities in Digital Signal Processing Solutions at the largest industry event for electronic engineers and managers in China.

Last year, the China International IC Conference & Exhibition was held only in Shanghai and was attended by 5,000 senior engineering managers, design engineers and government officials.

At IIC 1997, TI will present its capabilities in providing digital signal processing solutions. Senior engineers will present papers on digital control, DSP-based speaker phone and channel modulation techniques.


Portable by Des.

  • March 25-27, 1997
  • Santa Clara, CA

DSP World Spring/Communication Design Engineering Conference (CDEC)

  • March 26-27, 1997
  • Washington Convention Center, Booth 208
  • Washington DC
Texas Instruments, the world's leader in Digital Signal Processing Solutions, is demonstrating its latest line of TMS320 DSP and mixed-signal products. Highlighted is TI's latest generation of DSPs, the TMS320C6x. A special feature is TI's Third-Party Village where third-parties exhibit hardware and software products supporting the TMS320 family.

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