Process technology and a new device to enhance wireless apps

The ever-shrinking wireless telephone handset can soon be lightened by as many as 15 to 20 components, thanks to a new mixed-signal process technology developed by TI. The LinEPIC* III™ manufacturing process enables the integration of the entire battery management and analog baseband sections, two of the four major system blocks needed for digital cellular and personal communications systems (PCS) telephones. Consumers and service providers will benefit from the smaller form-factor handsets with increased battery life and longer talk and standby times.

TI also announced a new voice-band audio processor (VBAP), the TWL1101, which is designed for use in Code Division Multiple Access-based (CDMA) wireless handset applications. The device performs the transmit encoding (A/D conversion) and receive decoding (D/A conversion) and provides transmit and receive filtering for wireless phones and other voice-band communications systems.

The TWL1101 is an enhancement of TI's existing family of VBAP products and provides designers with greater programming flexibility and ease of design, while at the same time improving system voice quality and reducing power consumption. The device is manufactured on TI's LinEPIC II process and is available now in volume.

TWL1101

48-pin TQFP**

$3.45

Suggested resale pricing in U.S. dollars in 1K quantity.
* EPIC stands for Enhanced Performance Implanted CMOS. LinEPIC is a mixed-signal version of the TI digital CMOS process known as EPIC.
** The TWL1101 also is available in a microStar™ ball-grid array (BGA) package.
LinEPIC III and microStar are trademarks of Texas Instruments.

For complete information, order: TWL1101 Product Bulletin (SWMT001) and LinEPIC III Brochure (SWMB001). See Related Product Information.