Texas Instruments

Mixed Signal & Analog Showcase
Blue Band

Mixed Signal & Analog Showcase

Inside

Showcase (Volume 21) is available in HTML and PDF format. - 305KB

Single channel self-calibrating op amp

Product Features

  • Self-Cal VIO 40 mV max (TLC4501A)
  • Rail-to-rail output voltage swing
  • High output drive capability (50 mA)
  • 300 ms typical calibration time
  • 5-V single supply operation
  • Standard pinout
  • Operation over commercial (0°C to 70°C) and industrial (-40°C to 85°C) temperature ranges

The TLC4501 single-channel operational amplifier utilizes a new digital self-calibrating technique that eliminates many of the worries of designing with traditional precision operational amplifiers. The device uses on-chip digital and analog processing to achieve a precision of 40 µV maximum by automatically nulling its input offset voltage during power up. For designers of data acquisition systems, portable digital
scales, test and measurement equipment, portable medical systems and other precision systems, the device offers an appealing alternative to noisy chopper-stabilized op amps and higher-cost precision bipolar op amps. The TLC4501 single-channel op amp uses the same kind of self-calibrating scheme as TI’s dual-channel TLC4502, featured in Showcase volume 20.

The TLC4501 calibration technique
is identical to the TLC4502, featured in Showcase volume 20.

The TLC4501 offers designers a highly desirable combination of excellent DC precision, low noise (12 ), high output drive capability and low distortion. Additionally, with a gain bandwidth product of 4.7 MHz (typ) and a slew rate of 2.5 V/ms (typ), the TLC4501 is also a good choice for applications requiring good AC
performance. TLC4501 also features rail-to-rail output swing which, combined with high drive, makes it ideal for interfacing with A-D converters. And when designing battery-powered applications, the low supply current (1.25 mA) and 5-V single supply operation makes the TLC4501 an excellent choice. The device is available in 8-pin SOIC packaging.



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