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Inside
Showcase (Volume 22) is available in HTML and
PDF format. - 228KB
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Simplify designs with integrated 3-V
LDO and supply voltage supervisor
Product Features
- Integrated supply voltage supervisor and LDO regulator
- Low dropout voltage: (52 mV at 100 mA)
- Low quiescent current, 340 µA, independent of load
- Shutdown mode (0.5 µA typ)
- Wide load range: 0 to 500 mA
- Characterized for operation from –40°C to 125°
The TPS7330 is an integrated voltage supervisor and low dropout regulator designed for 3.0 V systems. It is a simple solution for systems needing both longer battery life and a supply voltage supervisor. The TPS7330 is optimized for power sensitive applications such as cellular telephones, Personal Digital Assistants, digital cameras and other low power portable systems.
The device features extremely low dropout voltage and quiescent currents made possible by replacing the conventional bipolar PNP pass transistor with a PMOS element. The TPS7330 has a maximum dropout voltage of 52 mV at 100 mA load, quiescent current of only 340 µA, and remains constant over the full 500 mA load range, even in dropout. A micropower shutdown mode further reduces supply current to just 0.5 µA, offering additional flexibility for power distribution and load management. The micro-power operation and very low dropout voltages significantly reduce system power consumption thereby extending battery life. Precision regulation is achieved with a maximum output voltage tolerance of 2% over full line, load and temperature conditions.
The TPS7330 is a new voltage option in TI’s TPS73xx family. This family shares the same feature set as TI’s TPS71xx ultra-low dropout regulators, with the addition of a precision supply voltage supervisor. An active-low RESET signal is automatically asserted during power up and power down, or any time the TPS7330 output drops below the threshold voltage. A preset 200 ms delay holds the RESET low to ensure that system voltage is stable before enabling sensitive circuits. The TPS7330 is available in 20-pin Thin Shrink Small Outline Package and 8-pin SOIC and DIP packages.
Vol 22 June, 1997
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