Inside

• Simplify designs with integrated 3-V LDO and supply voltage supervisor
• Lowest distortion 1.5 W stereo audio amplifier
• 8-Bit, 20 MSPS ADC with 4-volts of analog input range
• TI expands family of 3.3-V LVDS devices
• Ultra fast voltage comparators
• 20_Bit stereo A/D and D/A offers professional audio

Product Features

• THD+N <0.05% @ 1.5 W, 4

• High PSRR: 75 dB @ 5 V, 1 kHz
• Power-saving shutdown mode (I_DD<1 µA)
• Automatic switching between stereo speaker and headphone mode
• Unique stereo input MUX adds design flexibility
• Characterized for operation from –20°C to 85°

The TPA0102 is a complete audio solution in a single package. The device offers two (bridged-tied load) that can deliver 1.5 W continuous power per channel into 4- loads from a 5-V supply. This is achieved with less than 0.05% THD+N, making it the lowest distortion single chip solution in the industry for low voltage systems. For applications where speakers are driven as BTL and the line outputs (often headphones) are required to be SE, the TPA0102 automatically switches into SE mode delivering up to 500 mV of output power for channel when the SE/BTL input is activated. The TPA0102 provides high power supply rejection (75 dB) for increased fidelity. It is characterized at 3.3 V and 5 V operation and offers shutdown for power-sensitive applications.

The TPA0102 also has an integrated MUX on board to allow two sets of stereo inputs to the amplifier. This is especially valuable when both speakers and headphones are being driven since they may require different signal conditioning to provide the best possible sound to the user.

This functionality provides a very efficient upgrade path from the TPA4860, TPA4861, and TPA302 amplifiers where three separate ICs are required for stereo speaker and headphone drive. All of these functions are integrated in an ultra thin surface mount package saving the designer valuable board space and money.

The TPA0102 is available in TIs patented PowerPAD^TM 24-pin TSSOP (PWP) package. The PowerPAD package uses an exposed thermal pad, which can be soldered directly to the PCB, to provide extra heatsinking. When connected to ground planes in a typical multilayer board application, the PowerPAD package can dissipate over 2.5 W of power with zero airflow. This innovative method allows us to provide audio solutions in much smaller packages than competitive devices.

• TPA0102PWPLE