Best of both worlds

TI's latest DSP architecture combines the best features of MCUs and DSPs, delivering system-on-a-chip performance to mass storage.

The flexibility, ease-of-use and cost-efficiency of microcontrollers (MCUs) and the high-performance of digital signal processors (DSPs) are now available in a single architecture to meet the demands of the mass storage industry.

The new 100-MIPS TMS320C27x fixed-point DSP core from Texas Instruments will allow designers of hard disk drives and other high-density storage products such as digital video disks (DVD) and high-density floppies to realize the dream of creating no-compromise uniprocessor solutions for drive electronics.

The 'C27x, designed for embedded systems containing DSPs and general-purpose processors like microcontrollers, is a key addition to TI's customizable DSP (cDSP™) library. It's the first DSP core on the market to address all aspects of storage system requirements for integrated uniprocessor design. The 'C27x provides the highly efficient C compiling, linear address space and real-time control capabilities of an advanced MCU. It also permits development of a range of specialized integrated peripherals such as buffer management, multiplexers, bus interfaces, servo control logic and read channels.

Redefined DSP

DSP calculating capabilities serve to position recording heads more accurately on media surfaces, while at the same time controlling more precisely the speed of media rotation. In addition, the processor accommodates the enhanced partial response, maximum likelihood (EPRML) signal processing techniques employed in today's read channels.

Offering at least twice the performance of the most advanced DSPs currently in use for servo/spindle control, the 'C27x can accommodate future requirements brought on by new technologies such as microactuators, very high-speed motors and 6x or greater DVD.

"The new 'C27x core redefines the meaning of DSP in the storage world," said Briant Regan, TI mass storage marketing manager for DSP. "Not only is it a calculation engine, it is truly an optimized data storage processor."

Balanced architecture

The 'C27x architecture combines DSP high-speed multiply-and-accumulate (MAC) operations with the intensive I/O operations characteristic of MCUs. The result is that one device can provide the high-speed number crunching needed for real-time signal processing with the fast context switch and data manipulation capabilities required for control tasks.

To take advantage of the balanced 'C27x architecture, TI has developed an efficient C compiler that can produce compiled code denser than that of MCUs. Approaching the architecture's native assembly code in density, compiled code for the 'C27x requires half as much memory as equivalent compiled code for earlier DSPs. For the first time, designers will be able to implement completely the most demanding real-time applications in a high-level language.

The 'C27x is code compatible with the widely used TMS320 DSP family to provide a migration path for TI's existing DSP customers. Within its hardware is Real-Time Data Exchange (RTDX™) technology, an important innovation for system debug and development of highly integrated devices. (See RTDX article) Used in conjunction with an integrated JTAG port, RTDX enables 'C27x developers to isolate software bugs quickly and produce higher quality code in a shorter time.

Support

TI is making a major commitment to shorten time-to-market for 'C27x customers by developing more complete solutions called integration platforms. These platforms include a collection of macro cells required to meet a popular configuration, complete with fully tested firmware for both servo/spindle and controller operations.

Highly focused field and factory technical support is critical in the development of customized embedded processor solutions, and TI offers customers a mass storage dedicated firmware and hardware technical staff, each with long experience in storage processor solutions.

Availability

Most DSP solutions using the 'C27x core will be customized devices, with final pricing depending on the complexity of a particular design. TI has working silicon in .35-micron technology and is engaged with several mass storage customers today. Design models for .25 micron and denser process nodes will be available later this year. Contact your dedicated TI storage products sales office for more details.

cDSP and RTDX are trademarks of Texas Instruments.

For complete information, order: Technology Fact sheet (SPRT157). See Order form