Related Product Information

In This Issue
   DSP Solutions
The power of one
New development technology
   opens a window into real-
   world performance
DSP Solutions: A new age of
   network and global
   communications
'C549 meets need for power
   efficiency
Best of both worlds
App Report: Acoustic-echo
   cancellation software for
   hands-free wireless systems
CD-ROM and Internet provide
   easier access to DSP
   information

   Networking
The faster track
Industry leaders to conduct
   ADSL interoperability testing

   Mixed-Signal and Analog
Audio amplifiers
Dual line driver/receiver
Motor control devices offer
   enhanced functionality,
   lower cost
20-Gbps throughput ASIC
Stereo audio codec

   Business News
TI ships 10 millionth
   DSP to Maxtor
TI acquires Spectron
   Microsystems
IDT and TI to serve as
   alternate sources for
   3.3-V logic families

Packaging Reference Guide

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The SC Package Outlines Reference Guide

The 1998 Texas Instruments Semiconductor Package Outlines Reference Guide is now available. The guide contains outline drawings and information for packages currently offered by TI. To get your free copy, order: TI Semiconductor Package Outlines Reference Guide (SSYU001D). See Order form