|
|
General FAQ
1394 Isolation FAQ
Designer Kits FAQ
Link Layer Devices FAQ
Physical Layer Devices FAQ
|
|
1394 Designer Kits FAQ
TSBKPCI
| Q1: How is Analog_GND separated from Digital_GND? |
| AGND and DGND are the same on the EVM. So far we have not had any reported problems due to ground problems. |
| Q2: Does the EVM support Isolation? |
| No. This board does not support Isolation. Board schematic includes Isolation Caps but they are not installed on the board. Please refer to the bottom of each schematic to find out exactly which components are installed on the board. |
TSBKPCITST
| Q1: How is Analog_GND separated from Digital_GND? |
| AGND and DGND are the same on the EVM. So far we have not had any reported problems due to ground problems. |
| Q2: Does the EVM support Isolation? |
| No. This board does not support Isolation. Board schematic includes Isolation Caps but they are not installed on the board. Please
refer to the bottom of each schematic to find out exactly which components are installed on the board. |
| Q3: What are the differences between the TSBKPCI and TSBKPCITST? |
Both boards are similar in that the both utilize the PCILynx/TSB12LV21A and the TSB21LV03. However, the TSBKPCITST has the following features that are not included on the TSBKPCI.
- Zoom Video (ZV) connector headers
- Local SRAM on board
- Test Connectors
- Room for additional cicuitry
|
TSBKGPLYNX
| Q1: What are the hardware differences between the TSBKGPLYNX Designer Kit and the TSBKPRPHRL Designer Kit? |
| TSBKGPLYNX |
TSBKPRPHRL |
| TSB12LV31 Link Layer Included |
TSB12C01A Link Layer Included |
| Separate 8-bit Iso Port |
All data moved through micro-controller port |
| No Iso FIFO (External FIFO included on the board) |
Has Iso FIFO |
| TSB21LV03 can run upto 200 Mbps |
TSB11C01 limited to 100 Mbps |
| Link and PHY at 3.3V |
Link and PHY at 5.0V |
| 16 bit micro-interface |
32 bit micro-interface (board includes bus sizer for 16 bit c52 DSP) |
TSBKPRPHRL
| Q1: How is Analog_GND separated from Digital_GND? |
| AGND and DGND are the same on the EVM. So far we have not had any reported problems due to ground problems. |
| Q2: Does the EVM support Isolation? |
| No. This board does not support Isolation. Board schematic includes Isolation Caps but they are not installed on the board. Please refer to the bottom of each schematic to find out exactly which components are installed on the board. |
TSBKBACKPL
| Q1: How is Analog_GND separated from Digital_GND? |
| AGND and DGND are the same on the EVM. So far we have not had any reported problems due to ground problems. |
| Q2: Does the EVM support Isolation? |
| No. This board does not support Isolation. Board schematic includes Isolation Caps but they are not installed on the board. Please refer to the bottom of each schematic to find out exactly which components are installed on the board. |
|
|