Inside

• ADCs enable single chip solution from CCD output to digital domain
• New CD-based "Designer's Guide and Data Book" allow for powerful searches
• TI offers high-preformance total graphics solultion
• Programmable dual DACs let designers trade power for speed
• 10-Bit, 20 MSPS ADC provides high resolution and speed with 33% power savings
• Plug-N-Play platform provides easy evaluation of all TI audio power amplifiers
• 6 W stereo audio power amplifier in PowerPAD^TM package
• Three channel 1.75 W stereo audio power amplifier
• Fully integrated single channel PCMCIA power distribution switch
• High-speed 132 MBps PCI-to-PCI bridge
• RS-485 transceiver with integrated protection
• New amplifiers data book now available

6 W stereo audio power amplifier in PowerPAD^TM package

Product Features

• 6-W Stereo Output at 10% THD+N (5-W at 1% THD+N)
• High PSRR (65-dB, 1 kHz)
• Wide supply voltage range (9.5 V to 18 V)
• Mute and standby operation
• Pinout compatible with the TDA1517
• Characterized for operation from –20°C to 85°C

The TPA1517 is a stereo audio power amplifier capable of delivering 6-W per channel of continuous average power into a 4- load at 10% THD+N or 5-W at 1% THD+N. The device is designed for sound card and multimedia applications.

This single supply audio power amplifier operates with a wide supply voltage range (9.5 V to 18 V). It offers 65-dB (@ 1 kHz) of power supply ripple rejection for increased fidelity in noisy environments like desktop computers. The amplifier features a mute/standby function for increased life in battery powered systems.

The TPA1517 in the 20-pin DIP package (NE) is a low cost drop-in replacement to the TDA1517. The TPA1517 is also available in TI’s patented PowerPAD 20-pin SOIC (DWP) package. This package has an exposed thermal pad that can be soldered directly to the PCB to provide extra heatsinking. With only 1.25 In2 of copper area, the PowerPAD package can dissipate 2.5W of power at room temperature with zero airflow! Under the same conditions, the standard SOIC (DWP) package can only achieve 1.3W. For multi-layer board applications with a ground plane, the PowerPAD package usually requires no extra board space for heatsinking. This innovative method allows us to provide audio solutions in much smaller packages than competitive devices.

TPA1517DWP