Inside

• ADCs enable single chip solution from CCD output to digital domain
• New CD-based "Designer's Guide and Data Book" allow for powerful searches
• TI offers high-preformance total graphics solultion
• Programmable dual DACs let designers trade power for speed
• 10-Bit, 20 MSPS ADC provides high resolution and speed with 33% power savings
• Plug-N-Play platform provides easy evaluation of all TI audio power amplifiers
• 6 W stereo audio power amplifier in PowerPAD^TM package
• Three channel 1.75 W stereo audio power amplifier
• Fully integrated single channel PCMCIA power distribution switch
• High-speed 132 MBps PCI-to-PCI bridge
• RS-485 transceiver with integrated protection
• New amplifiers data book now available

Three channel 1.75 W stereo audio power amplifier

Product Features

• 1.75 W BTL center channel
• 600 mW stereo channels
• <0.05% THD+N at full power
• Specified at 3.3 V and 5 V
• Shutdown control IDD = 5 µA (typ)
• Operating Temperature –20°C to 85°C

The TPA0103 is a single chip stereo audio power amplifier designed to drive both a mono speaker and stereo headphones. This device is designed for desktop computers and PDA-type applications. The mono channel is in a bridged-tied load configuration (BTL) for delivering maximum output power from PC power supplies. It provides 1.75 W into a 4 load at 0.05% THD+N. The left/right channel outputs are single ended (SE) and are capable of delivering 500 mW of output power into a 4 load (0.2 % THD+N). For systems requiring headphone drive, the left and right channels will provide 80 mW into 32 loads at 0.05 % THD+N.

The TPA0103 provides high power supply rejection (75 dB) for increased fidelity, it is characterized at 3.3 V and 5 V operation and offers two types of shutdown: full shutdown where all three channels are powered down, or shutdown of the mono speaker channel for muting during headphone applications. In full shutdown mode, the supply current is 5 µA making the device ideal for battery powered systems.

The TPA0103 also has an integrated mux on board for independent gain control of headphone and speaker outputs.

The TPA0103 provides both the speaker and stereo headphone functions in a single 24-pin TSSOP PowerPAD^TM package saving valuable board space.

This device is available in a 24-pin TSSOP PowerPAD package.

The PowerPAD Advantage:

To address issues of heat dissipation in smaller IC packages Texas Instruments has introduced its patented PowerPAD package. The PowerPAD package uses an exposed thermal pad, which can be directly soldered to a printed circuit board to provide extra heatsinking. With this exposed thermal pad the PowerPAD package delivers TO-220-type thermal performance in a TSSOP package. Thermal impedances of approximately 35°C/W are achievable in multilayer board applications.

TPA0103PWPLE