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In This Issue
   DSP Solutions
Bridging the Gap
Digital Subscriber Line is
   the future of remote
   access technology
ADSL: A visionary architecture
   that meets changing market
   needs
High-speed networking over
   ordinary phone lines
TI acquires software tools
   maker GO DSP
TI's third-party network extends
   design team
App Report: Implementing Fast
   Fourier Transform Algorithms
   of Real-Valued Sequences with
   the TMS320 DSP Family

   Wireless
The next generation
Boom days ahead for the
   wireless market
Symposium maps the future
   of wireless

Sharing the knowledge
Zeroing in on the market
Technical details a few
   keystrokes away

   Mixed-Signal and Analog
Future Electronics becomes
   U.S. TI distributor
PCM codec-filter combo
   support four channels on a
   single chip
10-bit analog-to-digital converter
Gigabit ethernet transceiver

Support from PIC

Trade Shows

Wireless

Symposium maps the future of wireless

Designers of wireless and portable electronics systems can't afford to concentrate solely on one discipline, knowing little or nothing about others. To thrive and achieve in the fast-paced technology arena, they need general knowledge of radio frequency (RF), digital engineering, power management and other subjects.

CellphoneThat's where the Sixth Annual Wireless Symposium and Exhibition comes in. The event, which includes conferences and exhibits, will bring together more than 7,000 design engineers and other wireless communications professionals for educational workshops and technical discussions about what will make the vibrant wireless market tick now and in years to come.

Texas Instruments, a leading supplier of digital wireless technologies, will have a strong presence at the symposium, scheduled for Feb. 9-13 at the Santa Clara Convention Center in Santa Clara, Calif. TI's participation will include the presentation of five papers covering RF products, exhibits and demonstrations and a visionary keynote address by Christian Dupont, director of Americas Wireless Communications Business Unit.

As the leading supplier of Digital Signal Processing Solutions (DSPS), TI is positioned to provide the wireless market with cutting-edge DSP integration technology, mixed-signal expertise, radio frequency (RF) products, software and system support -- elements that can help manufacturers get to market faster.

In a few days, anyone attending the Wireless Symposium can learn about all the solutions TI offers for designing wireless equipment. Those who don't attend, can get information as well by contacting a local sales representative or visiting TI on the World Wide Web.

Win a free phone!
Visit TI's booth to register for a free Ericsson digital cellular phone.

Details

  • What: Sixth Annual Wireless Symposium and Exhibition
  • When: Feb. 9-13 (exhibits Feb. 10-12)
  • Where: Santa Clara Convention Center; Santa Clara, Calif.
  • TI booth: No.: 623

Presentations

Papers

Demonstrations

  • Digital baseband platform and Java demo
  • New RF synthesizer and power amplifier products
  • Live base station powered by TI DSPs
  • New power management and analog baseband products FLEX™ Messaging Solutions

Exhibit hours

  • Tues., Feb. 10: 1 to 7 p.m.
  • Wed., Feb. 11: 10 a.m. to 6 p.m.
  • Thur., Feb. 12: 10 a.m. to 2 p.m.
  • Information: www.penton.com/wireless

FLEX is a trademark of Motorola Inc.

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