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Mixed Signal & Analog Showcase
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Mixed Signal & Analog Showcase

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High-Speed Peripheral GeoPort™/AppleTalk™ Transceivers

Product Features

  • Single chip solution for AppleTalk, LocalTalk, and Geoport interfaces
  • Designed to operate from 100 Kbps up to 4Mbps full duplex
  • High ESD protection
  • Low stand-by supply current (30 µA typ)
  • Characterized for operation from 0oC to 70oC
The SN75LBC777 is a low-power LinBiCMOS device that incorporates the drivers and receivers for a 9-pin GeoPort peripheral interface and a switched-capacitor voltage converter for single 5-V supply operation. GeoPort combines hybrid EIA/TIA-422-B and EIA/TIA-423-B drivers and receivers to transmit data up to 4 Mbps, full duplex. The SN75LBC777 is designed to meet the GeoPort and AppleTalk standards. The peripheral manufacturer may easily integrate high-speed Power PC serial bus connections with a single transceiver that compliments the successful GeoPort/AppleTalk host transceivers, the SN75LBC771 and SN75LBC776. With high ESD protection, these devices minimize costly field failures and allow hot plug-and-play features.

All three devices reduce power consumption to less than 500 µW in shutdown mode. While the SN75LBC777 is powered-off (VCC = 0) the outputs are in a high impedance state. When the shutdown (SHDN) pin is high, the charge pump will be powered down and the outputs are in a high-impedance state. With a high input signal, the driver enable (DEN) terminal puts the outputs of the differential driver into a high-impedance state. The charge pumps on the SN75LBC776 and SN75LBC777 allow single +5V supply operation. They only require 75 mW (max) of no-load power. The SN75LBC771 uses ±5V power supplies to reduce component and systems level costs for systems with both supplies available.

Applications include connection to telephony, ISDN, digital sound and imaging, fax-data modems and other serial and parallel connections. The GeoPort is backwardly compatible to both LocalTalkª and AppleTalk. These devices are available in 20-pin SOIC packaging.

 TI&ME

Vol 19, October, 1996

(c) Copyright 1998 Texas Instruments Incorporated. All rights reserved.
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