Inside

PowerFLEX™, a low-cost alternative to TO-220

High performance PLL clock drivers

Digital control loop for 3-phase brushless dc motor

Cost-effective gigabit ethernet transceiver

SN75LVDM976, industry's first discrete dual mode LVDS SCSI transceiver

TRF2050, a 1.2 GHz fractional-N/integrator-N syntheszier

New external memory interface provides 8 hour speech duration

Sine-on, TI's information service for analog engineers

PowerFLEX™ packaging offers a low cost surface-mount alternative to TO-220

Product Features

• Low cost SMT
• Integrated heat slug
• Approximately 1.9-W power dissipation
• Low cost alternative to TO-220
• Lower profile than DPAK

Texas Instruments now offers industry-standard voltage regulators in thermally enhanced PowerFLEX surface-mount packaging. The new PowerFLEX packages deliver excellent power dissipation capability (1.9 W for the KTE and KTG packages and 1.8 W for the KTP package) for those looking to migrate from the bulky through-hole TO-220 package. Heat sinking is accomplished by soldering the devices to a copper pad, eliminating the effort and expense of bolting a TO-220 device to the PCB in high volume manufacturing processes. The KTP package represents a significant cost saving over the standard TO-220 package available from TI, while offering the additional benefit of surface mount technology. In addition, the PowerFLEX devices are slightly smaller and lower profile than DPAK and D2PAK regulators, while remaining footprint compatible.