-- Acronym Definitions --

ADC -- Analog-to-Digital Converter

BDM -- Background Debug Mode

CAN -- Controller Area Network

CDIP -- Ceramic Dual In-Line Package

CLCC -- Ceramic Leaded Chip Carrier

CMB -- Microcontroller Memory Board

COP -- Computer Operating Properly (Watchdog Timer)

CPU16 -- 16-Bit Central Processor Unit (HC11 Compatible)

CPU32 -- 32-Bit Central Processor Unit (68000 Compatible)

CTM -- Configurable Timer Module (Various Hardware Options)

DIP -- Dual In-line Package

DTMF -- Dual-Tone Multi-Frequency

EBI -- External Bus Interface

EM -- Emulation Module

EVB -- Evaluation Board

FPGA -- Field Programmable Gate Array

GPT -- General-Purpose Timer Module (4 IC, 5 OC, 2 PWM)

IC -- Input Capture

I2C -- Inter-Integrated Circuit

ICS -- In-Circuit Simulator (Board)

IDE -- Integrated Development Environment

i/o -- Bidirectional Input and Output Port Pins

i -- Input-Only Port Pins

IPB -- I/O Peripheral Board

ISPI -- Interval Serial Peripheral Interface

KBI -- Keyboard Interrupt

LCD -- Liquid Crystal Display

LTD -- Limited Availability

LQFP -- Low-Profile Quad Flat Pack

LVI -- Low-Voltage Interrupt

LVR -- Low-Voltage Reset

MC -- Fully Qualified Production

MCCI -- Multi-Channel Communication Interface (2 SCI, SPI)

MEVB -- Modular Evaluation Board

MFT -- Multi Function Timer

MMDS -- Motorola Modular Development System

MMEVS -- Motorola Modular Evaluation System

MPB -- Microcontroller Personality Board

MUX -- Multiplexed

o -- Output-Only Port Pins

OC -- Output Compare

PC -- Pre-Qualification, Engineering Samples Only

PEEP -- Personality EEPROM

PEP -- Personality EPROM

PFB -- Platform Board

PLCC -- Plastic Leaded Chip Carrier

PLL -- Phase-Locked Loop

PPB -- Package Personality Board

PQFP -- Plastic Quad Flat Pack

PWM -- Pulse-Width Modulation

QADC -- Queued Analog-to-Digital Converter (10-Bit)

QFP -- Quad Flat Pack

QSM -- Queued Serial Module (SCI + QSPI)

QSPI -- Queued SPI

RTI -- Real-Time Interrupt

SCI -- Serial Communication Interface

SCI+ -- Enhanced SCI

SCIM -- Single-Chip Integration Module

SDI -- Serial Debug Interface Cable (BDM Cable)

SDIP -- Shrink Dual In-line Package

SIM -- System Integration Module

SIML -- Low-Power System Integration Module

SIOP -- Simple Serial I/O Port

SPI -- Serial Peripheral Interface

SPI+ -- Enhanced SPI

SRAM -- Standby RAM Module

TC -- Target Cable

TH -- Target Head Adapter

TIB -- Target Interface Board

TPU -- Time Processing Unit (16 Programmable Channels)

TPURAM -- Standby RAM Module with TPU Emulation Capability

UART -- Universal Asynchronous Receiver/Transmitter

USB -- Universal Serial Bus

XC -- Initial Production Qualification, Not Fully Characterized

-- Package Designators --

B -- Shrink DIP (70 mil spacing)

DW -- Small Outline (Wide-Body SOIC)

FA -- 7 x 7 mm Quad Flat Pack (QFP)

FB -- 10 x 10 mm Quad Flat Pack (QFP)

FE -- CQFP (windowed) -- Samples Only

FN -- Plastic Quad (PLCC)

FS -- CLCC (windowed) -- Samples Only

FT -- 28 x 28 mm Quad Flat Pack (QFP)

FU -- 14 x 14 mm Quad Flat Pack (QFP)

FZ -- CQFP (windowed) -- Samples Only

K -- Cersdip (windowed) -- Samples Only

L -- Ceramic Sidebraze

P -- Dual in-Line Plastic

PU -- 14 x 14 mm Low-Profile Quad Flat Pack (LQFP)

PV -- 20 x 20 mm Low-Profile Quad Flat Pack (LQFP)

S -- Cerdip (windowed) -- Samples Only