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In This Issue

   Special Focus on Logic

   DSP Solutions
Meeting the DSP challenge
DSP designs of the future
'Tool Up' program allows
   designers to set up to next
   level of development
DSP Solutions: Analog and
   mixed-signal components
   moving up on the design
   priority list
New companies add more
   depth to already extensive
   network

   Wireless
Leading the Way
The heart of wireless at MTT-S
Covering all the bases

   Memory
64M DSRAM at PC100 spec
TI devlops new process to
   assemble DRAM chips

   Mixed-Signal and Analog
App Report: Understanding
   operational amplifier
   specifications
1394 native bridge link
   controller IC
PLL clock drivers
Long-duration speech processor
Hot plug controller
2.5-V SOT-23 supervisor with
   watchdog timer

   Business News
TI DSP chip wins innovation
   award
TI and Synopsys join forces to
   provide advanced ASIC design
   methodologies

Support from PIC

Trade Shows

Covering all the bases

By Sam Pritchett, RF Marketing Manager, North America

Manufacturers working to meet the growing demand for smaller, power-efficient portable wireless systems while also minimizing costs can get everything they need from Texas Instruments.

Already established in the wireless communications market as the world-leading supplier of digital signal processors (DSPs), analog baseband and power management, TI recently strengthened its position of providing total wireless solutions by introducing a family of radio frequency (RF) devices.

Now comes the latest addition, the TRF3040 modulator/synthesizer, representing another step in TI's commitment to deliver a leadership wireless RF portfolio. The TRF3040 is a highly integrated RF component targeting dual-mode, dual-band applications that will enable wireless original equipment manufacturers (OEMs) to create more affordable, longer-operating mobile phones.

TI's family of RF products is designed to provide optimal performance with the company's digital and analog baseband products. TI also offers a reliable supply of competitive products leveraged by its RF core competencies in wireless systems, RF design and RF-tailored, high-volume manufacturing processes.

With all the technology, such as CMOS, BiCMOS and RFMOS™, to integrate any aspect of the wireless telephone, TI has the capabilities to provide customers with the integration roadmap necessary to continue addressing the market's insatiable appetite for smaller phones that provide longer talk and standby times. This is evidenced by the TRF3040's ability to deliver in a single IC the high performance and high functional complexity needed to support dual-band, dual-mode applications (900 MHz AMPS, 900 MHz and 1900 MHz IS-136).

As cellular service rates continue to erode, the cost of the total solution must follow market trends. This is where TI's TRF3040 shines. With internal fractional compensation to minimize spurious energy content and a highly linear VGA and power amplifier driver to reduce external filter requirements, the TRF3040 sets up excellent system performance while minimizing external component count and cost.

Delivering the TRF3040 and many other wireless devices that help customers differentiate their products in the highly competitive wireless marketplace is where TI shines and covers all the bases.

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