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TI develops new process to assemble DRAM chips

New memory design technology developed by Texas Instruments can dramatically reduce the time and cost of assembling higher density memory devices.

This revolutionary process, board on chip ball grid array (BOC-BGA™), will lead to significant improvements in notebook, server and desktop computer systems. It will first appear in notebook and high-end servers within the next two years and could set the trend in building high-density memory modules in the future.

The BOC-BGA process uses printed circuit board (PCB) substrates in place of the conventional lead frame in the thin small outline package (TSOP). The BOC-BGA packages are smaller and more efficient, and they help to dissipate more heat than the conventional TSOP packages. The new design not only offers all the advantages of a chip-size package (CSP), but it also provides a low-cost solution in building stacked memory modules, effectively doubling the memory density per square unit.

This new technology is a major improvement over present BGA processes because it does not require major retooling costs. TI plans to phase the BOC-BGA process into its manufacturing plants within the next 18 months.

BOC-BGA is a trademark of Texas Instruments.

For complete information, order: BOC-BGA Product Brief (SMYT316). See Related Product Information