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In This Issue

   Special Focus on Logic

   DSP Solutions
Meeting the DSP challenge
DSP designs of the future
'Tool Up' program allows
   designers to set up to next
   level of development
DSP Solutions: Analog and
   mixed-signal components
   moving up on the design
   priority list
New companies add more
   depth to already extensive
   network

   Wireless
Leading the Way
The heart of wireless at MTT-S
Covering all the bases

   Memory
64M DSRAM at PC100 spec
TI devlops new process to
   assemble DRAM chips

   Mixed-Signal and Analog
App Report: Understanding
   operational amplifier
   specifications
1394 native bridge link
   controller IC
PLL clock drivers
Long-duration speech processor
Hot plug controller
2.5-V SOT-23 supervisor with
   watchdog timer

   Business News
TI DSP chip wins innovation
   award
TI and Synopsys join forces to
   provide advanced ASIC design
   methodologies

Support from PIC

Trade Shows

DSP designs of the future

Research that could bring dramatic improvements to sound, television, wireless communications, computer graphics, medical diagnostics and sports training were among the designs entered by eight other teams who ranked among finalists and semifinalists of TI's DSP Solutions Challenge.

Finalists

Virginia Polytechnic Institute & State University (Virginia Tech): Using TI's TMS320C541, designed an adaptive antenna array that allows wireless service providers to expand coverage, increase capacity and improve signal quality.

Nanyang Technological University (Singapore): Converted 5.1 channel Dolby Digital sound (AC-3) into 2-channel sound with the same quality.

Semifinalists

University of San Diego (U.S.): Using TI's TMS320C542, designed technology to compress voice messages for a pager, eliminating the need for a user to seek a telephone to retrieve messages.

Centro Federal de Educacao Tecnologica do Parana (CEFET) (Brazil): Project involved research that could improve detection and diagnosis of heart abnormalities because it enables round-the-clock data collection through data compression techniques on portable medical equipment.

Tokyo Institute of Technology (Japan): Developed a low-cost aid that collects real-time data for sports training.

Tianjin University (China): Using TI's TMS320C80, demonstrated a system to reduce noise and improve the quality of television broadcasts for High Definition TV (HDTV).

University of New South Wales (Australia): Solved complex problems with scalability to large sizes much less expensively than now possible on supercomputers.

Katholieke Universiteit-Leuven (Belgium): Designed a project that quickly and accurately extracts three-dimensional structures from a sequence of 2-D images.

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